Investor FAQs
Tower Semiconductor manufactures integrated circuits, offering a broad range of customizable process technologies including: SiGe, BiCMOS, Mixed-Signal/CMOS, RF CMOS, CMOS image sensor, non-imaging sensors and displays, integrated power management (BCD and 700V), and MEMS. Tower Semiconductor also provides a world-class design enablement platform for a quick and accurate design cycle as well as process transfer services including development, transfer, and optimization, to IDMs and fabless companies.
Through Tower Partners Semiconductor (TPSCo), Tower Semiconductor provides leading edge 45nm CMOS, 65nm RF CMOS and themost advanced 65nm image sensor technologies.
VISION: Provide the highest value analog semiconductor solutions as validated by our customers, employees, shareholders and partners.
MISSION: Being a trusted long-term partner with a positive and sustainable impact on the world through innovative analog technologies and manufacturing solutions.
Tower Semiconductor’s worldwide headquarters are located in Migdal Haemek (MH), Israel.
Tower Semiconductor operates two manufacturing facilities in Israel (150mm and 200mm), two in the U.S. (200mm), two facilities in Japan (200mm and 300mm) which it owns through its 51% holdings in TPSCo, a 300mm manufacturing facility in Agrate, Italy, shared with ST, as well as a 300mm capacity corridor in Intel’s New Mexico factory.
The company has a worldwide design center located in Netanya, Israel. Our global customer base is supported by sales offices in the US, Israel, China, Japan, Korea, and Taiwan.
Tower Semiconductor was founded in 1993, with the acquisition of National Semiconductor’s 150mm wafer fabrication facility in Migdal Haemek, Israel. Tower became a public company in 1994. In 2001, Fab 2, a 200mm facility, was constructed alongside Fab 1.
In 2008, Tower acquired Jazz Semiconductor’s 200mm facility (Fab 3) which increased global capacity, offered a more comprehensive technology portfolio, a larger customer base, and a stronger financial base.
In 2014, Tower Semiconductor completed a joint venture with Panasonic Corporation enabling Tower Semiconductor to offer its customers state of the art 300mm technology including best of class 65nm CMOS image sensor dark current and quantum efficiency performance and additional 45nm digital technology, adding available capacity of approximately 800,000 wafers per year (8 inch equivalent) in three manufacturing facilities in Japan.
In 2016, in order to support the company’s strong customer demand and to enable additional manufacturing flexibility, Tower acquired Maxim Integrated’s 8-inch wafer fabrication facility in San Antonio, Texas, United States, cost-effectively increasing production by approximately 28,000 wafers per month.
In 2020, Tower launched a new brand identity to reflect the Company’s global presence and strength, and highlight its focus to provide the highest value analog semiconductor solutions.
In 2021, Tower announced a partnership with ST Microelectronics to accelerate the Agrate, Italy 300mm analog and power fab capacity.
In 2023, Intel Foundry Services (IFS) and Tower announced a capacity corridor agreement providing Tower with 300mm manufacturing capacity in Intel’s manufacturing facility in New Mexico.
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